| 发明名称 |
Chemical mechanical polishing pad with clear endpoint detection window |
| 摘要 |
A chemical mechanical polishing pad is provided containing a polishing layer having a polishing surface; and, an endpoint detection window; wherein the endpoint detection window comprises a reaction product of ingredients, comprising: an isocyanate terminated urethane prepolymer having 5.5 to 9.5 wt % unreacted NCO groups, wherein the isocyanate terminated urethane prepolymer is a reaction product of ingredients comprising: an aliphatic polyfunctional isocyanate; and, a prepolymer polyol; and, a curative system, comprising: 0 to 99 wt % of a difunctional curative; and, 1 to 100 wt % of an amine initiated polyol curative having at least one nitrogen atom per molecule and an average of at least three hydroxyl groups per molecule. Also provide are methods of making and using the chemical mechanical polishing pad. |
| 申请公布号 |
US9333620(B2) |
申请公布日期 |
2016.05.10 |
| 申请号 |
US201414264576 |
申请日期 |
2014.04.29 |
| 申请人 |
Rohm and Haas Electronic Materials CMP Holdings, Inc.;Dow Global Technologies LLC |
发明人 |
Qian Bainian;DeGroot Marty W. |
| 分类号 |
B24B37/20;B24B37/013;B24B37/24;B24B49/12;H01L21/306 |
主分类号 |
B24B37/20 |
| 代理机构 |
|
代理人 |
Deibert Thomas S. |
| 主权项 |
1. A chemical mechanical polishing pad, comprising:
a polishing layer having a polishing surface; and, an endpoint detection window; wherein the endpoint detection window comprises a reaction product of ingredients, comprising:
(i) an isocyanate terminated urethane prepolymer having 5.5 to 9.5 wt % unreacted NCO groups, wherein the isocyanate terminated urethane prepolymer is a reaction product of ingredients comprising:
(a) an aliphatic polyfunctional isocyanate; and,(b) a prepolymer polyol; and,(ii) a curative system, comprising:
0 to 99 wt % of a difunctional curative; and,1 to 100 wt % of an amine initiated polyol curative having at least one nitrogen atom per molecule and an average of at least three hydroxyl groups per molecule. |
| 地址 |
Newark DE US |
