Method for producing structured microcarriers

摘要

The present invention relates to a method for producing microcarriers, the method comprising the steps of providing a wafer having a bottom layer, a top layer and an insulating layer, structuring the top layer to define at least one three-dimensional structure on the top surface of the top layer, etching away the top layer to delineate lateral walls of bodies of the microcarriers, applying a continuous polymer layer over the top surface of the bodies of the microcarriers, removing the bottom layer and the insulating layer, structuring the bottom surfaces of the bodies of the microcarriers to define at least one three-dimensional structure on the bottom surface of each body, and removing the polymer layer to release the microcarriers.

主权项

1. A method for producing microcarriers, the method comprising the following steps:
(a) providing a wafer having a sandwich structure comprising a bottom layer, a top layer and an insulating layer located between said bottom and top layers, (b) structuring the top layer to define at least one three-dimensional structure on a top surface of the top layer, (c) etching away the top layer to delineate lateral walls of bodies of the microcarriers, each body comprising at least one three-dimensional structure on its top surface, (d) applying a continuous polymer layer over the top surface of the bodies of the microcarriers, (e) removing the bottom layer and the insulating layer, (f) structuring the bottom surfaces of the bodies of the microcarriers to define at least one three-dimensional structure on the bottom surface of each body, and (g) removing the polymer layer to release the microcarriers.