Film made of polyaryleetherketone

摘要

The invention relates to a molding compound, comprising the following components: a) 60 to 96% by weight polyaryletherketone, b) 2 to 25% by weight hexagonal bornite, and c) 2 to 25% by weight talcum, wherein the sum of the parts by weight of components a), b), and c) is 100. Said compounds can be used to produce a film having a thickness of 5 to 1200 μm, which is suitable for producing dimensionally stable circuit boards.

主权项

1. A foil, comprising a layer of a molding composition, comprising:
from 60 to 96 parts by weight of polyarylene ether ketone, from 2 to 25 parts by weight of hexagonal boron nitride, and from 2 to 25 parts by weight of talc, based on 100 total parts by weight of polyarylene ether ketone, hexagonal boron nitride, and talc, wherein a d50 particle size of the boron nitride to ISO 13320 is at least 0.1 μm and at most 10 μm, and a corresponding d98 is at least 0.3 μm and at most 20 μm, a d50 particle size of the talc to ISO 13317, Part 3 is at least 0.1 μm and at most 10 μm, and a corresponding d98 is at least 0.3 μm and at most 20 μm the polyarylene ether ketone comprises a unit of formula:
(—Ar—X—)and a unit of the formula:
(—Ar′—Y—), wherein Ar and Ar′ are each independently a divalent aromatic moiety, each X is independently an electron-withdrawing group, at least 50% of X groups are carbonyl groups, each Y is independently O, S, CH2, or isopropylidene, and at least 50% of Y groups are O; and the layer of the molding composition has a thickness of 5 to 100 μm and has a dimensional change of less than 0.1% in both a longitudinal and transverse direction at temperatures up to 260° C.