Methods for assembling devices using pressure indicator adhesives

摘要

Pressure indicator pressure sensitive adhesive may contain microspheres that burst and release indicator when subjected to pressure and thereby produce a detectable indication of how much pressure has been applied when forming an adhesive joint between opposing structures. Electronic device structures can be assembled using the pressure indicator pressure sensitive adhesive. A camera or other sensor may monitor joint formation. The camera can gather infrared image data, visible light image data, or ultraviolet light image data. Sensor data such as magnetic or ultrasonic sensor data can also be collected on an adhesive joint. Joint inspection can be performed on test structures and production structures and corresponding adjustments made to the joint formation process. Positioners and other equipment that compresses the pressure indicator pressure sensitive adhesive can be adjusted in real time or calibrated using information about the condition of the pressure indicator pressure sensitive adhesive.

主权项

1. A method of forming adhesive joints, comprising:
compressing a pressure indicator pressure sensitive adhesive between a first structure and a second structure, wherein compressing the pressure indicator pressure sensitive adhesive comprises controlling computer-controlled positioners; inspecting the pressure indicator pressure sensitive adhesive to evaluate an adhesive joint formed from the pressure indicator pressure sensitive adhesive between the first structure and the second structure, wherein inspecting the pressure indicator pressure sensitive adhesive comprises capturing images of the pressure indicator pressure sensitive adhesive with a camera; and analyzing information from the camera and making pressure application adjustments to the computer-controlled positioners to adjust formation of the adhesive joint based on the analyzed information.