发明名称 Method for manufacturing liquid ejection head substrate
摘要 A method for manufacturing a liquid ejection head substrate, including: (1) a step for etching a substrate, which has an energy generating element at a side of a first surface, from a side of a second surface, which is a surface on the opposite side from the first surface, thereby to form at a time at least a part of a liquid supply port and a recess along a cutting section of the substrate; (2) a step for irradiating a laser beam toward the side of first surface from the etched surface of the recess so as to form a reformed portion inside the substrate; and (3) a step for cutting the substrate at the reformed portion.
申请公布号 US9333749(B2) 申请公布日期 2016.05.10
申请号 US201213669100 申请日期 2012.11.05
申请人 CANON KABUSHIKI KAISHA 发明人 Kato Masataka;Iri Junichiro;Kishimoto Keisuke;Yonemoto Taichi
分类号 B41J2/16;H01L21/768;H01J3/02 主分类号 B41J2/16
代理机构 Fitzpatrick, Cella, Harper & Scinto 代理人 Fitzpatrick, Cella, Harper & Scinto
主权项 1. A method for manufacturing a liquid ejection head substrate including an energy generating element that generates energy for ejecting a liquid and a liquid supply port for supplying the liquid to the energy generating element, the method comprising following steps in stated order: (1) a step for etching a substrate, which has the energy generating element at a side of a first surface, from a side of a second surface, which is a surface on an opposite side from the first surface, thereby to form at a time at least a part of the liquid supply port and a recess along a cutting section of the substrate; (2) a step for irradiating a laser beam toward the side of the first surface from an etched surface of the recess, the etched surface of the recess having been exposed by the etching, so as to form a reformed portion inside the substrate; and (3) a step for cutting the substrate at the reformed portion, wherein the liquid supply port comprises a common liquid supply port formed in the second surface and an individual liquid supply port formed in a bottom portion of the common liquid supply port, and the individual supply port and the recess are formed at a time in the step (1), and wherein the step (1) comprises following steps in stated order: (A) a step for preparing the substrate, which has the energy generating element at the side of the first surface and also has a first etching mask layer at the side of the second surface; and (B) a step for etching the substrate from the side of the second surface to form the common liquid supply port, and (C) a step for etching the substrate from the side of the second surface thereby to form at a time the individual liquid supply port and the recess; and wherein the first etching mask layer has an opening pattern in a region corresponding to the common liquid supply port.
地址 Tokyo JP