| 发明名称 | MEMS device connected to a substrate by flexible support structures | ||
| 摘要 | A MEMS assembly comprising a substrate and a MEMS device; wherein the MEMS device is connected to the substrate by at least two flexible support structures made in a conductive layer formed on a first portion of one of the substrate and the MEMS. | ||
| 申请公布号 | US9334153(B1) | 申请公布日期 | 2016.05.10 |
| 申请号 | US201414531861 | 申请日期 | 2014.11.03 |
| 申请人 | HRL Laboratories, LLC | 发明人 | Perahia Raviv;Nguyen Hung;Joyce Richard J. |
| 分类号 | B81B7/00;B81C1/00 | 主分类号 | B81B7/00 |
| 代理机构 | Ladas & Parry | 代理人 | Ladas & Parry |
| 主权项 | 1. A MEMS assembly comprising: a substrate; and a MEMS device; wherein the MEMS device is connected to the substrate by at least two flexible support structures made in a conductive layer formed on a first portion of one of said substrate and said MEMS. | ||
| 地址 | Malibu CA US | ||