Semiconductor device and method of manufacturing semiconductor device

摘要

A method of manufacturing a semiconductor device having a VDMOSFET (Vertical Double-diffused Metal Oxide Semiconductor Field-Effect Transistor) and a planar gate MOSFET (Metal Oxide Semiconductor Field-Effect Transistor), including forming a semiconductor layer of a first conductivity type by epitaxy, forming a body region recess for forming a body region of the VDMOSFET on the semiconductor layer, and embedding a semiconductor material of a second conductivity type in the body region recess by epitaxy or CVD (Chemical Vapor Deposition).

主权项

1. A semiconductor device having a VDMOSFET (Vertical Double-diffused Metal Oxide Semiconductor Field-Effect Transistor) and a planar gate MOSFET (Metal Oxide Semiconductor Field-Effect Transistor), comprising:
a semiconductor layer of a first conductivity type, the semiconductor layer having a body region recess formed thereon and recessed from a surface thereof in a first element forming region on which the VDMOSFET is formed; a body region of a second conductivity type embedded in the body region recess; and a well region of the second conductivity type formed in the surface of the semiconductor layer in a second element forming region on which the planar gate MOSFET is formed, wherein each of the body region and the well region is an epitaxial layer, or a layer formed by chemical vapor deposition (CVD), that contains an impurity of the second conductivity type, and the body region and the well region have the same impurity concentration profiles, with uniform impurity concentrations in the depth directions respectively.