| 摘要 |
PROBLEM TO BE SOLVED: To provide a patterning method and a patterning device suitable for miniaturization of wiring pattern, and improving the use efficiency of a material forming the wiring, when forming a conductive wiring pattern.SOLUTION: A liquid repellent layer 110 is formed by coating the surface of a substrate 100 with process liquid containing a surface modifier for modifying from liquid repellency to lyophilic by light energy. The liquid repellent layer 110 is irradiated with light energy corresponding to the wiring pattern. As a result, a region irradiated with light energy is modified from liquid repellency to lyophilic, and some components produced by modification evaporate, and a modified groove 120 is formed in a region corresponding to the wiring pattern. A wiring pattern can be formed by supplying a metal ink 130 to the groove 120.SELECTED DRAWING: Figure 6 |
