CHUCK STRUCTURE FOR HEATING A WAFER

摘要

The present invention relates to a chuck structure for heating a wafer and, more specifically, to a chuck structure for heating a wafer when electrical performance of semiconductor devices formed on a wafer is inspected using a probe card. The chuck structure for heating a wafer includes a chuck plate, at least a center heater, and an external heater. The wafer to be inspected by the probe card is placed on the upper part of the chuck plate. The center heater heats the wafer by being arranged at a part facing the center of the wafer of the chuck plate. The external heater heats the wafer with the center heater by enclosing the outer circumference of the chuck plate.