| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having excellent performance in low dielectric property, high thermostability and low hygroscopicity and useful for applications such as lamination, molding, casting and adhesion, and a cured article thereof.SOLUTION: There are provided an epoxy resin composition containing an epoxy resin having a structure obtained by reaction of a compound represented by the formula (1) and epihalohydrin and a curing agent as essential components, and a cured article thereof, where n is a repeating number and its average is a value of 0<n≤10, A is each independently a bivalent group having an aliphatic ring structure, B is each independently a bivalent hydrocarbon group, Ris each independently H, a halogen atom, or a C1 to 10 hydrocarbon group.SELECTED DRAWING: None |
