发明名称 LAMINATED FILM MANUFACTURING METHOD, CIRCUIT BOARD MANUFACTURING METHOD, ROLL BODY, AND RELEASE FILM
摘要 PROBLEM TO BE SOLVED: To provide a laminated film manufacturing method capable of suppressing the occurrence of a temperature variation when heating a laminated film in a wound state.SOLUTION: A laminated film manufacturing method comprises: a preparation step of preparing a laminated film comprising a substrate film and a transparent conductive film installed on the substrate film; a winding step of winding the laminated film; and a heat treatment step of heating the laminated film in a wound state. In the winding step, a release film having a release surface is inserted between the laminated films superposed to each other by the winding. A plurality of thermal conductive fillers are dispersed in the release film.SELECTED DRAWING: Figure 1
申请公布号 JP2016068481(A) 申请公布日期 2016.05.09
申请号 JP20140202171 申请日期 2014.09.30
申请人 DAINIPPON PRINTING CO LTD 发明人 OTSUKA KENSUKE;TSUBOI TATSUYA;OGAWA KENICHI;HONMA SATOSHI
分类号 B32B27/20;B29C71/02;B32B37/06;H01B13/00 主分类号 B32B27/20
代理机构 代理人
主权项
地址