发明名称 |
LAMINATED FILM MANUFACTURING METHOD, CIRCUIT BOARD MANUFACTURING METHOD, ROLL BODY, AND RELEASE FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a laminated film manufacturing method capable of suppressing the occurrence of a temperature variation when heating a laminated film in a wound state.SOLUTION: A laminated film manufacturing method comprises: a preparation step of preparing a laminated film comprising a substrate film and a transparent conductive film installed on the substrate film; a winding step of winding the laminated film; and a heat treatment step of heating the laminated film in a wound state. In the winding step, a release film having a release surface is inserted between the laminated films superposed to each other by the winding. A plurality of thermal conductive fillers are dispersed in the release film.SELECTED DRAWING: Figure 1 |
申请公布号 |
JP2016068481(A) |
申请公布日期 |
2016.05.09 |
申请号 |
JP20140202171 |
申请日期 |
2014.09.30 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
OTSUKA KENSUKE;TSUBOI TATSUYA;OGAWA KENICHI;HONMA SATOSHI |
分类号 |
B32B27/20;B29C71/02;B32B37/06;H01B13/00 |
主分类号 |
B32B27/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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