| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which requires no strict dimensional control of a resin case or no assembly accuracy control of the semiconductor device, and allows easy joining of a semiconductor element and a wiring terminal within an intended interval range; and provide a manufacturing method of the semiconductor device.SOLUTION: A semiconductor device of the present embodiment comprises: an insulating substrate 1 where a circuit pattern 3 is provided; semiconductor elements 5, 6 joined on the circuit pattern 3 by brazing filler metals 13; and a wiring terminal 8 joined to an electrode provided on the semiconductor elements 5, 6 on the side opposite to the circuit pattern 3, by brazing filler metals 14. A part of the wiring terminal 8 contacts the insulating substrate 1 and is insulated from the circuit pattern 3.SELECTED DRAWING: Figure 3 |
