A slurry for chemical mechanical planarization includes a surfactant, and abrasive particles having an average diameter between 20 and 30 nm and an outer surface of ceria. The abrasive particles are formed using a hydrothermal synthesis process. The abrasive particles are between 0.1 and 3 wt% of the slurry.
申请公布号
WO2016069244(A1)
申请公布日期
2016.05.06
申请号
WO2015US54952
申请日期
2015.10.09
申请人
APPLIED MATERIALS, INC.
发明人
ARNEPALLI, RANGA RAO;VISSER, ROBERT JAN;BAJAJ, RAJEEV;THAKARE, DARSHAN;GORADIA, PRERNA;MAHAJAN, UDAY;MOHAMMED, ABDUL WAHAB
