发明名称 HEAT-DISSIPATING STRUCTURE
摘要 The present invention provides a heat-dissipating structure capable of obtaining high heat dissipation properties by increasing the adhesion between a heat sink and a heat-generating component. A heat-dissipating structure (1) having a first heat-generating component (3) and a heat sink (2), wherein: the heat sink (2) has a base section (6) and a heat-dissipating fin (7) provided in an upright manner on a first surface (6a) of the base section (6); and the heat-dissipating fin (7) has an insertion groove (8) into which the first heat-generating component (3) is insertable, and is further provided with a sandwiching member (9) for sandwiching the heat-dissipating fin (7) from the widthwise direction of the insertion groove (8) while the heat-generating component (3) is inserted into the insertion groove (8).
申请公布号 WO2016067393(A1) 申请公布日期 2016.05.06
申请号 WO2014JP78783 申请日期 2014.10.29
申请人 SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. 发明人 IKEDA KOSUKE;MORINAGA YUJI;MATSUZAKI OSAMU
分类号 H01L23/36;H01L25/07;H01L25/18;H05K7/20 主分类号 H01L23/36
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