发明名称 |
HEAT-DISSIPATING STRUCTURE |
摘要 |
The present invention provides a heat-dissipating structure capable of obtaining high heat dissipation properties by increasing the adhesion between a heat sink and a heat-generating component. A heat-dissipating structure (1) having a first heat-generating component (3) and a heat sink (2), wherein: the heat sink (2) has a base section (6) and a heat-dissipating fin (7) provided in an upright manner on a first surface (6a) of the base section (6); and the heat-dissipating fin (7) has an insertion groove (8) into which the first heat-generating component (3) is insertable, and is further provided with a sandwiching member (9) for sandwiching the heat-dissipating fin (7) from the widthwise direction of the insertion groove (8) while the heat-generating component (3) is inserted into the insertion groove (8). |
申请公布号 |
WO2016067393(A1) |
申请公布日期 |
2016.05.06 |
申请号 |
WO2014JP78783 |
申请日期 |
2014.10.29 |
申请人 |
SHINDENGEN ELECTRIC MANUFACTURING CO., LTD. |
发明人 |
IKEDA KOSUKE;MORINAGA YUJI;MATSUZAKI OSAMU |
分类号 |
H01L23/36;H01L25/07;H01L25/18;H05K7/20 |
主分类号 |
H01L23/36 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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