| 发明名称 |
LID AND METHOD FOR SEALING A NON-MAGNETIC PACKAGE |
| 摘要 |
A non-magnetic lid for sealing a hermetic package. The lid includes a molybdenum substrate having a sputtered adhesion layer and a copper seed layer. The lid also includes a plated palladium solder base layer, and has gold/tin solder preforms attached to a sealing surface of the lid. |
| 申请公布号 |
US2016122183(A1) |
申请公布日期 |
2016.05.05 |
| 申请号 |
US201414529410 |
申请日期 |
2014.10.31 |
| 申请人 |
General Electric Company |
发明人 |
KAPUSTA CHRISTOPHER;AIMI MARCO FRANCESCO |
| 分类号 |
B81C1/00;C23C28/02 |
主分类号 |
B81C1/00 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A metallic non-magnetic lid for sealing a hermetic package, comprising:
a molybdenum substrate; a sputtered adhesion layer; a copper seed layer; a palladium solder base layer; and gold/tin solder preforms attached at a sealing surface of the lid. |
| 地址 |
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