发明名称 METHOD FOR PRODUCING A PLASTIC CONTAINER HAVING A TWO-DIMENSIONALLY EXTENDING ELECTRONIC ELEMENT, PLASTIC CONTAINER PRODUCED ACCORDING TO SAID METHOD AND INJECTION MOLD FOR CARRYING OUT THE METHOD
摘要 In order to produce a plastic container (1,2) having a planar electronic element (15), a planar electronic element (15) is introduced into a recess (29) of an inner face of a mold. The mold comprises an outer mold part (10) and a mold core (11), which form a mold cavity (12). Molten plastic material is injected into the mold cavity (12). After the subsequent cooling of the plastic material, mold removal is carried out. The recess (29) is arranged on an inner face (26) of the outer mold part (10). The molten plastic material is injected into the mold cavity in such a way that the molten plastic material flows substantially parallel along a surface (25) of the planar electronic element (15) facing the mold cavity (12). The planar electronic element (15) is an RFID inlay, for example. The planar electronic element does not require a protective casing and can be sprayed directly.
申请公布号 US2016121527(A1) 申请公布日期 2016.05.05
申请号 US201514931967 申请日期 2015.11.04
申请人 WEIDMANN PLASTICS TECHNOLOGY AG 发明人 EGGMANN Kurt;MAZENAUER Karl;AKERMANN Michael
分类号 B29C45/14;B65D25/20 主分类号 B29C45/14
代理机构 代理人
主权项 1. A method for producing a plastic container having a two-dimensionally extending electronic element in the form of an RFID inlay, the method comprising at least the following steps: a.) providing a two-dimensionally extending RFID inlay being realized without a protective covering, a mold and a first plastic component in the form of a molten plastic material, wherein the mold features an outer mold part with a first inner face and a mold core with a second inner face, said first and said second inner face together forming a mold cavity, and wherein the outer mold part comprises a recess being formed by a collar-shaped elevation of the first inner face; b.) introducing the two-dimensionally extending RFID inlay without a protective covering into the recess of the mold; c.) fixing the two-dimensionally extending RFID inlay in the recess; d.) injecting the first plastic component into the mold cavity of the mold and onto the two-dimensionally extending RFID inlay; and e.) subsequently to step d.), cooling the first plastic component
地址 Rapperswil CH