| 发明名称 |
ELECTRONIC COMPONENT MOUNTING SUBSTRATE, MOTOR, AIR-CONDITIONING APPARATUS, AND METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT MOUNTING SUBSTRATE |
| 摘要 |
An electronic component mounting substrate includes an electronic component mounted on a surface of a substrate, an electrode portion disposed on the surface of the substrate and electrically connected to the electronic component, a lead wire connected to the electrode portion, and an encapsulation resin configured to encapsulate a part of the lead wire, the electronic component, and the electrode portion. A surface of at least the part of the lead wire encapsulated by the encapsulation resin and the surface of the substrate are coated with a deposited film. |
| 申请公布号 |
US2016128195(A1) |
申请公布日期 |
2016.05.05 |
| 申请号 |
US201514872185 |
申请日期 |
2015.10.01 |
| 申请人 |
Mitsubishi Electric Corporation |
发明人 |
MATSUNAGA Noriaki |
| 分类号 |
H05K1/18;H05K1/05;H05K3/30;H02K11/00 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component mounting substrate comprising:
an electronic component mounted on a surface of a substrate; an electrode portion disposed on the surface of the substrate and electrically connected to the electronic component; a lead wire connected to the electrode portion; and an encapsulation resin configured to encapsulate a part of the lead wire, the electronic component, and the electrode portion, a surface of at least the part of the lead wire encapsulated by the encapsulation resin and the surface of the substrate being coated with a deposited film. |
| 地址 |
Tokyo JP |
