发明名称 METHOD OF MANUFACTURING CONDUCTIVE WIRING AND CONDUCTIVE WIRING
摘要 A method of manufacturing conductive wiring includes: printing on an insulated substrate 1 with ink 2 to form a predetermined pattern (S1); placing (spraying) conductive powder 3 on the ink 2 (in the predetermined pattern) before the printed ink 2 dries (S2); pressing the placed conductive powder 3 against the insulated substrate 1 to compress the conductive powder 3 (S3); and heating the compressed conductive powder 3 to sinter the conductive powder 3 (S4), and by such a series of processes (S1 to S4), conductive wiring 20 is manufactured.
申请公布号 US2016128189(A1) 申请公布日期 2016.05.05
申请号 US201414897862 申请日期 2014.10.24
申请人 SHUHOU CO., LTD. 发明人 MURAOKA Kouji
分类号 H05K1/09;H05K3/14 主分类号 H05K1/09
代理机构 代理人
主权项 1. A method of manufacturing conductive wiring, the method comprising: printing on an insulated substrate with ink to form a predetermined pattern; placing conductive powder on the ink before the ink dries; pressing the placed conductive powder against the insulated substrate to compress the conductive powder; and heating the compressed conductive powder to sinter the conductive powder, wherein the insulated substrate is white or transparent, and the heating includes irradiating the compressed conductive powder with YAG laser light.
地址 Fukui JP