BOTTOM-UP ELECTROLYTIC VIA PLATING METHOD

摘要

Disclosed herein is a bottom-up electrolytic via plating method wherein a first carrier substrate and a second substrate having at least one through-via are temporarily bonded together. The method includes applying a seed layer on a surface of the first substrate, forming a surface modification layer on the seed layer or the second substrate, bonding the second substrate to the first substrate with the surface modification layer to create an assembly wherein the seed layer and the surface modification layer are disposed between the first and second substrates, applying conductive material to the through-via, removing the second substrate having the through-via containing conductive material from the assembly.

主权项

1. A method for producing a conductive through-via, comprising:
obtaining a first substrate having a surface; obtaining a second substrate having a first surface, a second surface, and a through-via extending from the first surface to the second surface; applying a seed layer on a surface of a first substrate; forming a surface modification layer on the seed layer or the second substrate; bonding the second substrate to the first substrate with the surface modification layer to create an assembly, wherein the seed layer and the surface modification layer are disposed between the first and second substrates; applying conductive material to the through-via; and removing the second substrate from the assembly after applying the conductive material to the through-via.