发明名称 |
ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR |
摘要 |
In an electronic component, a functional circuit, signal wiring electrically connected to the functional circuit, and ground wiring electrically connected to the functional circuit and electrically connected to a ground potential are located on one surface of a circuit substrate, a frame member is provided to secure a region between itself and an outer peripheral edge of a first main surface of the circuit substrate and so as to surround the functional circuit, the ground wiring extends from inside to outside the frame member, and a shield member extends from a second main surface of the circuit substrate to a region on the first main surface via the side surfaces, the shield member being electrically connected to the ground wiring in the region outside the frame member. |
申请公布号 |
US2016126931(A1) |
申请公布日期 |
2016.05.05 |
申请号 |
US201614994642 |
申请日期 |
2016.01.13 |
申请人 |
Murata Manufacturing Co., Ltd. |
发明人 |
TSUDA Motoji |
分类号 |
H03H9/64;H03H9/54;H05K9/00;H03H3/08 |
主分类号 |
H03H9/64 |
代理机构 |
|
代理人 |
|
主权项 |
1. An electronic component comprising:
a circuit substrate including first and second main surfaces that oppose each other, and side surfaces that connect the first and second main surfaces to each other; a functional circuit that is located on the first main surface of the circuit substrate; signal wiring that is located on the first main surface of the circuit substrate and is electrically connected to the functional circuit; ground wiring that includes a wiring portion located on the first main surface of the circuit substrate, that is electrically connected to the functional circuit and that is electrically connected to a ground potential; and a frame member that is arranged to secure a region between the frame member and an outer peripheral edge of the first main surface of the circuit substrate and so as to surround the functional circuit; wherein the ground wiring extends from inside to outside the frame member; and a shield member extends from the second main surface of the circuit substrate to a region outside the frame member on the first main surface of the circuit substrate via the side surfaces, the shield member including a conductive material so as to be electrically connected to the ground wiring in the region outside the frame member. |
地址 |
Nagaokakyo-shi JP |