发明名称 ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
摘要 In an electronic component, a functional circuit, signal wiring electrically connected to the functional circuit, and ground wiring electrically connected to the functional circuit and electrically connected to a ground potential are located on one surface of a circuit substrate, a frame member is provided to secure a region between itself and an outer peripheral edge of a first main surface of the circuit substrate and so as to surround the functional circuit, the ground wiring extends from inside to outside the frame member, and a shield member extends from a second main surface of the circuit substrate to a region on the first main surface via the side surfaces, the shield member being electrically connected to the ground wiring in the region outside the frame member.
申请公布号 US2016126931(A1) 申请公布日期 2016.05.05
申请号 US201614994642 申请日期 2016.01.13
申请人 Murata Manufacturing Co., Ltd. 发明人 TSUDA Motoji
分类号 H03H9/64;H03H9/54;H05K9/00;H03H3/08 主分类号 H03H9/64
代理机构 代理人
主权项 1. An electronic component comprising: a circuit substrate including first and second main surfaces that oppose each other, and side surfaces that connect the first and second main surfaces to each other; a functional circuit that is located on the first main surface of the circuit substrate; signal wiring that is located on the first main surface of the circuit substrate and is electrically connected to the functional circuit; ground wiring that includes a wiring portion located on the first main surface of the circuit substrate, that is electrically connected to the functional circuit and that is electrically connected to a ground potential; and a frame member that is arranged to secure a region between the frame member and an outer peripheral edge of the first main surface of the circuit substrate and so as to surround the functional circuit; wherein the ground wiring extends from inside to outside the frame member; and a shield member extends from the second main surface of the circuit substrate to a region outside the frame member on the first main surface of the circuit substrate via the side surfaces, the shield member including a conductive material so as to be electrically connected to the ground wiring in the region outside the frame member.
地址 Nagaokakyo-shi JP