| 发明名称 |
WIRING BOARD |
| 摘要 |
The wiring board of the present invention includes an insulating layer, a strip-shaped wiring conductor for signals disposed on a main surface of the insulating layer, and a plain conductor for grounding or power disposed on the main surface of the insulating layer; and the thickness of the plane conductor is larger than the thickness of the strip-shaped wiring conductor. In the wiring board of the present invention, the thickness of the plane conductor is preferably 1 to 15 μm larger than the thickness of the strip-shaped wiring conductor. The strip-shaped wiring conductor has a thickness of preferably 3 to 10 μm, and the plane conductor has a thickness of preferably 5 to 15 μm. |
| 申请公布号 |
US2016128183(A1) |
申请公布日期 |
2016.05.05 |
| 申请号 |
US201514918618 |
申请日期 |
2015.10.21 |
| 申请人 |
KYOCERA Circuit Solutions, Inc. |
发明人 |
MATSUMOTO Keisaku |
| 分类号 |
H05K1/02 |
主分类号 |
H05K1/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wiring board comprising:
an insulating layer; a strip-shaped wiring conductor for a signal disposed on a main surface of the insulating layer; and a plane conductor for grounding or power disposed on the main surface of the insulating layer, wherein the thickness of the plane conductor is larger than the thickness of the strip-shaped wiring conductor. |
| 地址 |
Kyoto JP |
