| 发明名称 |
Electronic Component |
| 摘要 |
In an embodiment, a method includes inserting an electronic component including a power semiconductor device embedded in a dielectric core layer into a slot in a side face of a circuit board. The inserting the electronic component causes one or more electrically conductive contacts on one or more surfaces of the electronic component to electrically couple with one or more corresponding electrical contacts arranged on one or more surfaces of the slot. |
| 申请公布号 |
US2016128198(A1) |
申请公布日期 |
2016.05.05 |
| 申请号 |
US201414533597 |
申请日期 |
2014.11.05 |
| 申请人 |
Infineon Technologies Austria AG |
发明人 |
Standing Martin;Pawley Marcus;Roberts Andrew;Clarke Robert |
| 分类号 |
H05K1/18;H01L23/31;H05K3/00;H05K1/11;H05K3/46;H05K3/30;H01L23/00 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method, comprising:
inserting an electronic component comprising a power semiconductor device embedded in a dielectric core layer into a slot in a side face of a circuit board, wherein the inserting the electronic component causes one or more electrically conductive contacts on one or more surfaces of the electronic component to electrically couple with one or more corresponding electrical contacts arranged on one or more surfaces of the slot. |
| 地址 |
Villach AT |
