SEMICONDUCTOR DEVICE

摘要

A semiconductor device includes: an insulating substrate including an insulating plate and a circuit board on the insulating plate; a semiconductor chip having an electrode on a front surface thereof, a back of the semiconductor chip being fixed to the circuit board; a printed circuit board that faces the circuit board and the front surface of the semiconductor chip; and one or more conductive posts each having one end connected via solder to the circuit board or to the electrode on the semiconductor chip, another end connected to the printed circuit board, and one or more grooves that extend from said one end of the conductive post that contacts the solder to said another end of the conductive post connected to the printed circuit board.

主权项

1. A semiconductor device, comprising:
an insulating substrate including an insulating plate and a circuit board on the insulating plate; a semiconductor chip having an electrode on a front surface thereof, a back of said semiconductor chip being fixed to said circuit board; a printed circuit board that faces said circuit board and the front surface of said semiconductor chip; and one or more conductive posts each having one end connected via solder to said circuit board or to said electrode on said semiconductor chip, another end connected to said printed circuit board, and one or more grooves that extend from said one end of the conductive post that contacts the solder to said another end of the conductive post connected to said printed circuit board.