| 发明名称 |
Pb-FREE SOLDER AND ELECTRONIC COMPONENT BUILT-IN MODULE |
| 摘要 |
A Pb-free solder includes a first metal including at least Sn and Bi, and a second metal including at least an Ni—Fe alloy. In the first metal, the sum of Sn and Bi is 90 mass % or more, and a ratio of Bi is 5 to 15 mass %. A ratio of the second metal to the sum of mass of the first metal and mass of the second metal is 5 to 30 mass % |
| 申请公布号 |
US2016121434(A1) |
申请公布日期 |
2016.05.05 |
| 申请号 |
US201514923853 |
申请日期 |
2015.10.27 |
| 申请人 |
TDK CORPORATION |
发明人 |
YASUI Tsutomu;KAWABATA Kenichi |
| 分类号 |
B23K35/26;B23K35/02;C22C13/02;C22C19/03;H05K1/11;H05K1/18 |
主分类号 |
B23K35/26 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A Pb-free solder comprising:
a first metal including at least Sn and Bi; and a second metal including at least an Ni—Fe alloy, wherein, in the first metal, a sum of Sn and Bi is 90 mass % or more, and a ratio of Bi is 5 to 15 mass %, and a ratio of the second metal to a sum of mass of the first metal and mass of the second metal is 5 to 30 mass %. |
| 地址 |
Tokyo JP |
