发明名称 WIRELESS IC DEVICE AND COMPONENT FOR A WIRELESS IC DEVICE
摘要 To provide a small and low-profile component of a wireless IC device and the wireless IC device while increasing the mechanical strength and the environment resistance performance of a wireless IC chip. A component (20A) of a wireless IC device including a wireless IC chip (5) and a feeding circuit substrate (10) on which resin layers are laminated. The wireless IC chip (5) is incorporated inside the feeding circuit substrate (10), and an annular electrode (25) is arranged inside the feeding circuit substrate (10). The component (20A) of a wireless IC device and the radiation plate constitute the wireless IC device.
申请公布号 EP2282372(A4) 申请公布日期 2016.05.04
申请号 EP20090754726 申请日期 2009.05.27
申请人 MURATA MANUFACTURING CO. LTD. 发明人 KATO NOBORU;SASAKI JUN
分类号 H01Q1/50;G06K19/07;G06K19/077;H01Q1/22;H01Q1/38;H01Q1/40;H01Q7/00;H01Q23/00 主分类号 H01Q1/50
代理机构 代理人
主权项
地址