Electrostatic chuck device

摘要

An electrostatic chuck device (1) according to the invention includes an electrostatic chuck section (2) that has a principal surface as a placement surface on which a plate-shaped sample is placed, and is made to have an internal electrode for electrostatic adsorption built-in, and a cooling plate section (3) that cools the electrostatic chuck section (2), wherein a heating member (5) is bonded to a principal surface on the opposite side to the placement surface of the electrostatic chuck section (2) through a first adhesive material layer (4), and the electrostatic chuck section (2) and the heating member (5) are bonded to and integrated with the cooling plate section (3) through an acrylic adhesive layer (9) having flexibility and insulation properties.

主权项

1. An electrostatic chuck device comprising:
an electrostatic chuck section that has a principal surface as a placement surface on which a plate-shaped sample is placed, and is made to have an internal electrode for electrostatic adsorption built-in; and a cooling plate section that cools the electrostatic chuck section, wherein a heating member is bonded to a principal surface on the opposite side to the placement surface of the electrostatic chuck section through a first adhesive material layer, the electrostatic chuck section and the heating member are bonded to and integrated with the cooling plate section through an acrylic adhesive layer having flexibility and insulation properties, and a thickness of the acrylic adhesive layer is set to be 250 μm or less, a Young's modulus of a spacer that is provided between the heating member and the cooling plate section is set to be in a range of 5 MPa or more and 5 GPa or less, and a difference in thermal expansion between the spacer and the acrylic adhesive layer is set to be ±200% or less.