Method of mounting electronic parts

摘要

In an electronic component mounting method, electronic components are picked up from a component supply unit in which first and second tray supply mechanisms are arranged, and mounted on substrates. In the method, a first substrate and a second substrate different in type from the first substrate are transported by first and second substrate transport lanes, respectively, and a first component to be mounted on the first substrate and a second component to be mounted on the second substrate are supplied by the first and second tray supply mechanisms, respectively. If use stop setting indicating that the pickup of the electronic components is no longer conducted is enabled in one tray supply mechanism, the controller prohibits an access of a mounting head to the one tray supply mechanism, and permits an operation access of an operator to a tray housing unit of the one tray supply mechanism.

主权项

1. A component mounting method using an electronic component mounting apparatus comprising:
a substrate transport mechanism comprising a first substrate transport lane and a second substrate transport lane which transport substrates on which electronic components are to be mounted and which are arranged in parallel; a component supply unit that is disposed on a side of the substrate transport mechanism and supplies the electronic components; and a tray feeder that comprises a first tray supply mechanism and a second tray supply mechanism arranged in parallel, each having a function of retrieving trays from a tray housing unit that is disposed in the component supply unit and houses the trays storing therein the electronic components in a plane, and transferring the trays to a component pickup position; a component mounting mechanism comprising: a mounting head that picks up and holds the electronic components from the trays transferred to the component pickup position; and a head transfer mechanism that transfers the mounting head; and a controller that controls the substrate transport mechanism, the component supply unit, and the component mounting mechanism, whereby the electronic components are picked up from the component supply unit by the mounting head, and mounted on the substrates transported by the substrate transport mechanism, said component mounting method comprising: transporting a first substrate by the first substrate transport lane, and a second substrate different in type from the first substrate by the second substrate transport lane; supplying a first component to be mounted on the first substrate by the first tray supply mechanism, and a second component to be mounted on the second substrate by the second tray supply mechanism; outputting a scheduled production number completion signal or a scheduled production number completion estimate signal for a substrate type of one of the first substrate and the second substrate; executing, by the controller in response to the scheduled production number completion signal or the scheduled production number completion estimate signal, a use stop setting for one of the first tray supply mechanism and the second tray supply mechanism corresponding to the substrate type to which the scheduled production number completion signal or the scheduled production number completion estimate signal is outputted while continuing a component mounting operation by the other of the first tray supply mechanism and the second tray supply mechanism; and executing a preceding setup change operation for producing a subsequent substrate type for the tray supply mechanism that has been set to the use stop setting while continuing a component mounting operation by allowing the controller to prohibit an access of the mounting head to the tray supply mechanism having been set to the use stop setting, and to permit an operation access of an operator to the tray housing unit of the tray supply mechanism.