Housing that includes reflector part and housing material formed with plastic material

摘要

A method can be used to produce a housing for an optoelectronic semiconductor device. A reflector part, which has an inner area configured to reflect electromagnetic radiation, is encased in places with a housing material using an injection molding method. The inner area of the reflector part remains free of the housing material at least in places. The reflector part is formed with a first plastic material and the housing material is formed with a second plastic material that is different than the first plastic material. The first plastic material and the second plastic material differ from one another with regard to at least thermal stability or resistance to electromagnetic radiation.

主权项

1. A method for producing a housing for an optoelectronic semiconductor device, the method comprising:
providing a reflector part, which has an inner area configured to reflect electromagnetic radiation; and surrounding the reflector part in places with a housing material; wherein the surrounding is performed using an injection-molding method; wherein the inner area of the reflector part remains free of the housing material at least in places; wherein the reflector part is formed with a first plastic material; wherein the housing material is formed with a second plastic material; wherein the first plastic material is different than the second plastic material; wherein the first plastic material and the second plastic material differ from one another with regard to at least thermal stability or resistance to electromagnetic radiation; and wherein, before providing the reflector part, the method further comprises forming the reflector part by machining or by performing an injection-molding method.