发明名称 |
Ball grid array rework |
摘要 |
Embodiments of the invention relates to a method for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components. |
申请公布号 |
US9332639(B2) |
申请公布日期 |
2016.05.03 |
申请号 |
US201514836363 |
申请日期 |
2015.08.26 |
申请人 |
International Business Machines Corporation |
发明人 |
Kline Eric V.;Sinha Arvind K. |
分类号 |
H01L21/44;H01L21/48;H01L21/50;H05K1/11;H05K13/04;B23K1/018 |
主分类号 |
H01L21/44 |
代理机构 |
Lieberman & Brandsdorfer, LLC |
代理人 |
Lieberman & Brandsdorfer, LLC |
主权项 |
1. A method comprising:
placing an expansion material between a ball grid array (BGA) package assembled in communication with a printed circuit board, including the expansion material placed interstitially within a matrix of solder joints between the BGA package and the printed circuit board; controlling a tensile force applied between a ball grid array (BGA) package and the printed circuit board, including delivering electric current to the expansion material; and the electric current creating localized heating of the expansion material; the heated material applying an expansion force to the solder joints, including separation of the BGA package from the printed circuit board. |
地址 |
Armonk NY US |