发明名称 |
SEMICONDUCTOR PACKAGE FOR MEMS DEVICE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
In some embodiments, a semiconductor package can include: (a) a base having a cavity; (b) an interposer coupled to the base and at least partially over the cavity such that the interposer and the base form a back chamber, the interposer has a first opening into the back chamber; (c) a micro-electro-mechanical system device located over the interposer at the first opening; and (d) a lid coupled to the base. Other embodiments also are disclosed. |
申请公布号 |
HK1176743(A1) |
申请公布日期 |
2016.04.29 |
申请号 |
HK20130103697 |
申请日期 |
2013.03.25 |
申请人 |
UBOTIC INTELLECTUAL PROPERTY CO. LTD. |
发明人 |
LO, CHI KWONG CK;WAN, LIK HANG LH;TAM, MING WA MW |
分类号 |
H01L;B81B;H04R |
主分类号 |
H01L |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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