| 摘要 |
The present invention relates to a method for forming a circuit pattern of a printed circuit board, and a main objective of the present invention is to provide a method for forming a circuit pattern that can miniaturize a printed circuit board having both a high-current circuit pattern and a low-current circuit pattern, such as a smart junction block. To achieve this, disclosed is the method for forming a circuit pattern of a printed circuit board. The method includes the steps of: providing the printed circuit board having circuit patterns of the same thickness on a base substrate; providing a plate, to which an additional conductive pattern having the same shape and pattern path as the circuit pattern selected from the circuit patterns, is attached; overlapping a plate on the printed circuit board such that an additional conductive pattern is bonded onto the selected circuit pattern; and removing the plate to finish the circuit pattern, the thickness of which is adjusted while the additional conductive pattern is fixed to the selected circuit pattern. |
