发明名称 FinFET with an Asymmetric Source/Drain Structure and Method of Making Same
摘要 Embodiments of the present disclosure are a semiconductor device, a FinFET device, and a method of forming a FinFET device. An embodiment is a semiconductor device comprising a first semiconductor fin extending above a substrate, a first source region on the first semiconductor fin, and a first drain region on the first semiconductor fin. The first source region has a first width and the first drain region has a second width with the second width being different than the first width.
申请公布号 US2016118462(A1) 申请公布日期 2016.04.28
申请号 US201614987351 申请日期 2016.01.04
申请人 Taiwan Semiconductor Manufacturing Company, Ltd. 发明人 Tseng Hsiang-Jen;Chiang Ting-Wei;Chen Wei-Yu;Yang Kuo-Nan;Song Ming-Hsiang;Guo Ta-Pen
分类号 H01L29/08;H01L21/306;H01L29/78;H01L21/283;H01L29/417;H01L27/088;H01L29/66;H01L21/8234 主分类号 H01L29/08
代理机构 代理人
主权项 1. A method comprising: etching a first recess in a first semiconductor fin; epitaxially growing a first semiconductor material in the first recess to form a first source region, the first source region having a first width; etching a second recess in the first semiconductor fin; epitaxially growing a second semiconductor material in the second recess to form a first drain region, the first drain region having a second width, the second width being smaller than the first width; and forming a first active gate over the first semiconductor fin, the first active gate being laterally between the first source region and the first drain region.
地址 Hsin-Chu TW