发明名称 LIGHT EMISSION MODULE
摘要 PROBLEM TO BE SOLVED: To provide a light emission module in which the width of a substrate can be reduced.SOLUTION: A light emission module has a substrate, plural mounting portions arranged on the substrate so as to stand in a line, and plural semiconductor light emission elements each of which is provided to each of the mounting portions. The plural mounting portions contain one or more first mounting portions each of which has a wiring portion provided with the semiconductor light emission element, a first separation portion disposed away from the wiring portion in a predetermined direction intersecting to the arrangement direction of the plural mounting portions, and a second separation portion disposed so as to sandwich the wiring portion between the second separation portion and the first separation portion, and one or more second mounting portions each of which has a wiring portion, a second separation portion disposed in the predetermined direction and a first separation portion disposed so as to sandwich the wiring portion between the first separation portion and the second separation portion, the first mounting portions and the second mounting portions being alternately arranged on the substrate. In each semiconductor light emission element, an anode electrode is connected to the first separation portion, and a cathode electrode is connected to the second separation portion. The wiring portions are electrically connected to one another in parallel by connection members disposed between the plural separation portions and the plural wiring portions provided with the semiconductor light emission elements.SELECTED DRAWING: Figure 7
申请公布号 JP2016066707(A) 申请公布日期 2016.04.28
申请号 JP20140194774 申请日期 2014.09.25
申请人 TOSHIBA LIGHTING & TECHNOLOGY CORP 发明人 SHIBUSAWA SOICHI
分类号 H01L33/62;F21S2/00;F21V19/00 主分类号 H01L33/62
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