发明名称 LASER PROCESSING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a laser processing device that eliminates re-fixation of a body to be molten with which a laser light beam is irradiated.SOLUTION: A laser processing device comprises: work holding means of holding a work; laser light beam irradiation means of irradiating the work held by the work holding means with a laser light beam; and processing advancing means of performing relative processing advancing of the work holding means and laser light beam irradiation means. The work holding means comprises: a holding table which comprises a plurality of relief grooves having holding surfaces for sucking and holding the work and formed corresponding to regions where the work held on the holding surfaces is irradiated with the laser light beam, and a suction hole made open to the regions defined by the plurality of relief grooves and connected to suction means; and high-pressure air jetting means comprising an air jet nozzle for jetting high-pressure air to the relief grooves of the holding table to blow away a melt of the workpiece falling on the relief grooves as the work held on the holding surfaces is irradiated with the laser light beam.SELECTED DRAWING: Figure 2
申请公布号 JP2016064418(A) 申请公布日期 2016.04.28
申请号 JP20140193340 申请日期 2014.09.24
申请人 DISCO ABRASIVE SYST LTD 发明人 AIKAWA RIKI;MATSUMOTO KOICHI
分类号 B23K26/10;B23K26/142;H01L21/301 主分类号 B23K26/10
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