PHOTOSENSITIVE ADHESIVE COMPOSITION AND SEMICONDUCTOR DEVICE

摘要

This photosensitive adhesive composition is characterized by containing (A) an alkali-soluble resin, (B) a photoacid generator, (C) an epoxy compound, and (D) a phenol compound having a melting point of 50–150 °C. By using a cured product of the photosensitive adhesive composition as an adhesive layer that adheres semiconductor elements to one another, it is possible to prevent bubbles (voids) from forming in an interface between the adhesive layer and a semiconductor element, and, even when bubbles form in the interface, to remove said bubbles. As a result, it is possible to enhance the adhesiveness (close adhesion) of semiconductor elements to one another.