发明名称 PHOTOCURABLE ADHESIVE FOR INKJET, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a photocurable adhesive for inkjet, which is cured to form an adhesive layer with high accuracy and is capable of making it hard to generate voids in the adhesive layer.SOLUTION: The photocurable adhesive for inkjet according to the present invention is applied using an inkjet apparatus for use, is cured by irradiation with light for use, contains a photocurable compound and a photopolymerization initiator, and contains or does not contain a solvent. When the adhesive contains the solvent, the content of the solvent is 1 wt.% or less. The viscosity of the adhesive at 25°C and 1 rpm is 160 to 1,600 mPa s (inclusive) as measured according to JIS K2283.SELECTED DRAWING: Figure 1
申请公布号 JP2016065171(A) 申请公布日期 2016.04.28
申请号 JP20140195517 申请日期 2014.09.25
申请人 SEKISUI CHEM CO LTD 发明人 TANIGAWA MITSURU;WATANABE TAKASHI;UEDA TSUNEHISA;INUI YASUSHI;TAKAHASHI RYOSUKE;INOUE TAKANORI;FUJITA YOSHITO
分类号 C09J4/02;C09J5/00;H01L21/52 主分类号 C09J4/02
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