| 摘要 |
This cooling device has: an evaporation section for storing a refrigerant; a condensation section for radiating the heat of a gas-phase refrigerant, which has been gasified by the evaporation section, by condensing and liquefying the gas-phase refrigerant; a vapor pipe for transporting the gas-phase refrigerant to the condensation section; a liquid pipe for transporting a liquid-phase refrigerant, which has been condensed by the condensation section, to the evaporation section; and a mounting plate provided with a connection structure connected to the device side which is to be cooled. The evaporation section is disposed on one surface of the mounting plate, and the condensation section is disposed on the other side of the mounting plate. This method for manufacturing a cooling device is configured in such a manner that a mounting plate is formed by providing a connection structure to a flat surface member, an evaporation section is disposed on one surface of the mounting plate, a condensation section is disposed on the other side of the mounting plate, and the condensation section is connected to the evaporation section by piping. In cooling devices using a phase change cooling method, the cost of manufacturing the entirety of each of the devices increases because the interchangeability of the device with existing cooling devices needs to be ensured. |
