| 发明名称 |
COOLING CONFIGURATION FOR A COMPONENT |
| 摘要 |
A component includes at least one thermal riser that extends from an exterior surface of the component. At least one cooling passage extends through a wall and adjoins an interior cooling passage and provides an exterior surface. At least one cooling passage is configured to direct cooling fluid through the wall adjacent to at least one thermocouple. |
| 申请公布号 |
US2016115871(A1) |
申请公布日期 |
2016.04.28 |
| 申请号 |
US201514878498 |
申请日期 |
2015.10.08 |
| 申请人 |
United Technologies Corporation |
发明人 |
Slavens Thomas N.;Clum Carey |
| 分类号 |
F02C7/18;F02C3/04 |
主分类号 |
F02C7/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A component comprising:
at least one thermal riser with an imbedded temperature measurement device extending from an exterior surface of the component; and at least one cooling passage extending through a wall adjoining an interior cooling passage and providing an exterior surface, wherein the at least one cooling passage is configured to direct cooling fluid through the wall adjacent the at least one thermocouple. |
| 地址 |
Hartford CT US |
