CIRCUIT STRUCTURE AND METHOD FOR MANUFACTURING CIRCUIT STRUCTURE

摘要

A circuit structure 10 is provided with the following: a circuit substrate 15; a heat dissipating member 23 that is disposed on the circuit substrate 15 and dissipates heat from the circuit substrate 15; an insulating layer 26 that is formed on the surface of the heat dissipating member 23, such surface being on the circuit substrate 15 side; adhesive portions 20 which are made of an adhesive agent 20A and are disposed in prescribed regions between the circuit substrate 15 and the heat dissipation member 23; and bonding portions 22 that are disposed in regions, other than the prescribed regions, between the circuit substrate 15 and the heat dissipating member 23, the bonding portions 22 being made of a bonding agent 22A that has a weaker adhesive strength than the adhesive agent 20A when bonding the circuit substrate 15 to the heat dissipating member 23.