CONDUCTIVE PASTE, CONNECTION STRUCTURE AND METHOD FOR PRODUCING CONNECTION STRUCTURE

摘要

PROBLEM TO BE SOLVED: To provide a conductive paste which can improve conduction reliability between electrodes.SOLUTION: A conductive paste comprises a thermosetting compound and a thermosetting agent as a thermosetting component, and a plurality of solder particles, where the thermosetting compound comprises a crystalline phenol aralkyl epoxy compound.SELECTED DRAWING: Figure 1