| 摘要 |
PROBLEM TO BE SOLVED: To provide a scribe line-forming method of a wafer laminate for an image sensor and a scribe line-forming device of the wafer laminate for the image sensor, by and with which the wafer laminate for the image sensor can be parted effectively and finely according to a dry-system simple technique without using a dicing saw.SOLUTION: A wafer laminate W for an image sensor is structured by bonding a glass wafer 1 and a silicon wafer 2 by a resin layer 4 which is disposed so as to surround photodiode formation regions 3. A scribe line-forming method of the wafer laminate W for the image sensor and a scribe line-forming device are disclosed. The scribe line-forming method includes: forming a scribe line S1 by pressing/rolling a scribing wheel 10 along a predetermined parting line on a top face of the glass wafer 1; and next forming a scribe line S2 by pressing/rolling a diamond point cutter 25 including a protrusive blade point 25b on a tip of a blade body 25a along a predetermined parting line on an outer surface of the silicon wafer 2. |
