| 摘要 |
The invention provides a laser processing method and device with high energy utilization rate and capable for forming cutting initial points definitely. A method for forming the cutting initial points of the to-be-processed object includes an emitting step of amplifying oscillation pulse light oscillated by an oscillator in an amplifier by utilizing a CPA method and emitting the amplified light from a light source; and an irradiating step of irradiating laser beams on the to-be-processed object in a manner of forming exposed areas corresponding to the unit pulse light on a to-be-processed surface, so that cleavages or cracks of the to-be-processed object between the exposed areas are formed. Therefore, the cutting initial points are formed on the to-be-processed object. And in the emitting step, by adjusting extracting sequence of extracting laser beams in the amplifier, two pulse light beams are emitted from the light source at a time interval that is short than an emitting period of unit pulse light. Besides, in the irradiating step, the two pulse light beams are sent to the same area substantially. |
