SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

摘要

The present disclosure provides a method for manufacturing a semiconductor package to increase the probability of delamination. The method includes the steps of: (1) determining a die warpage value within a predetermined temperature range, (2) determining difference between the density of an upper metal and the density of a lower metal of a substrate according to the die warpage value, and (3) combining the substrate and the die under the predetermined temperature. The upper metal includes all the metal layers placed on an intermediate layer. The lower metal includes all the metal layers placed under the intermediate layer. The intermediate layer includes a core or a metal layer.