发明名称 配線基板
摘要 [Problem] To provide a printed circuit board in which holes in a printed wiring can be readily filled with solder and the heat can be readily decreased , even if the printed wiring has a greater length or width. [Solution] A printed circuit board (1) on which a plurality of electronic components are arranged, a printed wiring (2) for causing a current to flow between the electronic component being provided to the printed circuit board, the electronic components being connected using solder to the printed wiring (2) by soldering; the printed circuit board being characterized in that: a plurality of long holes (3) are provided, along the current flow, to the printed wiring (2); the long holes (3) form a first long hole row (31) along the direction of current flow, and a second long hole row (32) provided alongside the first long hole row (31); the long holes in the second long hole row (32) are provided so as to face a spacing between long holes that are disposed in series in the first long hole row (31); and the solder (8) fills the long holes in the first long hole row (31) and the long holes in the second long hole row (32).
申请公布号 JP5909660(B2) 申请公布日期 2016.04.27
申请号 JP20130546502 申请日期 2012.06.18
申请人 パナソニックIPマネジメント株式会社 发明人 齋藤 孝夫
分类号 H05K1/02 主分类号 H05K1/02
代理机构 代理人
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