| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring structure having high reliability and a manufacturing method thereof, and also to provide an electronic device having the wiring structure and a manufacturing method thereof.SOLUTION: A wiring structure includes: a first insulation resin layer 17 formed on a base material 10; a wiring 22 formed in a groove 18 formed in the first insulation resin layer; and a second insulation resin layer 24 formed in the groove so as to cover the upper surface of the wiring and capturing wiring constituent atoms diffused from the wiring. |
