发明名称 Methods and apparatus for conductive element deposition and formation
摘要 A conductive element such as an antenna, for use in electronic devices, including mobile devices such as cellular phones, smartphones, personal digital assistants (PDAs), laptops, and wireless tablets. In one exemplary aspect, the present disclosure relates to a conductive antenna formed using deposition of conductive fluids as well as the method and equipment for forming the same. In one embodiment, a “thick” antenna element can be formed in one pass of a dispensing head or nozzle, thereby reducing manufacturing cost and increasing manufacturing efficiency.
申请公布号 US9325060(B2) 申请公布日期 2016.04.26
申请号 US201514620108 申请日期 2015.02.11
申请人 Pulse Finland OY 发明人 Kalistaja Esa;Galla Elli;Kuehler Dan;Childers Winthrop
分类号 H01Q9/04;H05K3/32;H01Q1/38;H05K3/12 主分类号 H01Q9/04
代理机构 Gazdzinski & Associates PC 代理人 Gazdzinski & Associates PC
主权项 1. A method of forming an assembly having at least one conductive trace, the method implemented using an apparatus configured to eject drops of a conductive fluid comprising: providing a substrate upon which the at least one conductive trace is to be deposited; causing transport of at least a portion of the apparatus over a surface of the substrate while ejecting a plurality of conductive fluid drops to form the at least one conductive trace, each of the plurality of conductive fluid drops comprising a volume of at least 500 pL; and heating at least the at least one conductive trace to remove at least a portion of the plurality of conductive fluid drops so as to render the at least one trace substantially permanent on said substrate.
地址 Oulunsalo FI