发明名称 温度検出装置
摘要 An apparatus for detecting temperatures of power-conversion semiconductor elements, which is applicable to a system including a plurality of power-conversion semiconductor elements and a plurality of temperature signal outputs for outputting temperature signals correlated to temperatures of the respective semiconductor elements. In the apparatus, the temperature signal outputted from at least one of the temperature signal outputs is input directly to a microcomputer without passing through at least one input-output interface. The temperature signals outputted from the other two or more temperature signal outputs are input to a plurality of input ports of the at least one input-output interface sequentially connected to an output of the interface. The microcomputer detects the temperatures of the respective semiconductor elements based on the temperature signals received from the output port of the at least one input-output interface and the temperature signal received directly from the at least one of the temperature signal outputs.
申请公布号 JP5907236(B2) 申请公布日期 2016.04.26
申请号 JP20140220603 申请日期 2014.10.29
申请人 株式会社デンソー 发明人 大徳 修;藤田 浩
分类号 H02M7/48 主分类号 H02M7/48
代理机构 代理人
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