CLOSED LOOP MATERIAL PRESSURE CONTROL FOR THE ENCAPSULATION PROCESS OF ELECTRONIC COMPONENTS,申请号AU20030256292-传众专利搜索

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发明名称	CLOSED LOOP MATERIAL PRESSURE CONTROL FOR THE ENCAPSULATION PROCESS OF ELECTRONIC COMPONENTS
摘要
申请公布号	AU2003256292(A1)	申请公布日期	2004.02.25
申请号	AU20030256292	申请日期	2003.07.30
申请人	KEMET ELECTRONICS CORPORATION	发明人	DAVID, BRUCE JACOBS;HENRY, MICHAEL BULLOCK;DOUGLAS, CLINTON, JR. BYRD
分类号	B29C45/02;B29C45/77;(IPC1-7):B29C45/02	主分类号	B29C45/02
代理机构		代理人
主权项
地址

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