发明名称 |
Wiring board and method of manufacturing the same |
摘要 |
Provided is a wiring board including: an insulating board having a mounting portion configured such that a semiconductor element is mounted on an upper surface thereof; a semiconductor element connection pad formed on the mounting portion; a conductor pillar formed on the semiconductor element connection pad; and a solder resist layer adhered on the insulating board. The solder resist layer has a first region with a thickness such that the semiconductor element connection pad and a lower end portion of the conductor pillar are embedded while an upper end portion of the conductor pillar protrudes, and a second region having a thickness larger than that of the first region and surrounding the first region. |
申请公布号 |
US9326389(B2) |
申请公布日期 |
2016.04.26 |
申请号 |
US201414518082 |
申请日期 |
2014.10.20 |
申请人 |
KYOCERA CIRCUIT SOLUTIONS, INC. |
发明人 |
Yokoyama Mitsuzo |
分类号 |
H05K7/10;H05K3/34;H05K3/40;H05K1/11;H05K3/46 |
主分类号 |
H05K7/10 |
代理机构 |
Volpe and Koenig, P.C. |
代理人 |
Volpe and Koenig, P.C. |
主权项 |
1. A wiring board comprising: an insulating board having a mounting portion configured such that a semiconductor element is mounted on an upper surface thereof; a semiconductor element connection pad formed on the mounting portion; a conductor pillar formed on the semiconductor element connection pad; and a solder resist layer adhered on the insulating board, wherein the solder resist layer has a first region with a thickness such that the semiconductor element connection pad and a lower end portion of the conductor pillar are embedded while an upper end portion of the conductor pillar protrudes, and a second region having a thickness larger than that of the first region and surrounding the first region, wherein the semiconductor element is placed on top of the conductor pillar to be connected therewith, and a gap between the semiconductor element and the solder resist layer in the first region is filled with an under fill. |
地址 |
Kyoto JP |