发明名称 |
Heat spreader with high heat flux and high thermal conductivity |
摘要 |
A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks. |
申请公布号 |
US9326383(B2) |
申请公布日期 |
2016.04.26 |
申请号 |
US201313913114 |
申请日期 |
2013.06.07 |
申请人 |
Teledyne Scientific & Imaging, LLC. |
发明人 |
Cai Steve Qingjun;Chen Chung-Lung;Tsai Chialun |
分类号 |
F28D15/02;H05K3/22;B23P15/26;F28D15/04;H01L21/48;H01L23/427 |
主分类号 |
F28D15/02 |
代理机构 |
Brooks Acordia IP Law, P.C. |
代理人 |
Brooks Acordia IP Law, P.C. |
主权项 |
1. A method for assembling a heat spreader system, comprising:
providing a plurality of bottom microporous wicks recessed in a bottom substrate; bonding a center substrate to said bottom substrate; bonding a top substrate having a top chamber portion to said center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks; etching a bottom substrate side port along one side of said bottom substrate; etching a top substrate side port along one side of said top substrate; providing a center substrate side port in said center substrate; and aligning said bottom substrate side port, top substrate side port and center substrate side port to one another prior to said bonding said center substrate and said bonding said top subtrate. |
地址 |
Thousand Oaks CA US |